The MAX1710/MAX1711 step-down controllers are intended for core CPU DC-DC converters in notebook computers. They feature a triple-threat combination of ultra-fast transient response, high DC accuracy, and high efficiency needed for leading-edge CPU core power supplies. Maxim's proprietary Quick-PWM™ quick-response, constant-on-time PWM control scheme handles wide input/output voltage ratios with ease and provides 100ns "instant-on" response to load transients while maintaining a relatively constant switching frequency.
High DC precision is ensured by a 2-wire remote-sensing scheme that compensates for voltage drops in both the ground bus and supply rail. An on-board, digital-toanalog converter (DAC) sets the output voltage in compliance with Mobile Pentium II® CPU specifications.
The MAX1710 achieves high efficiency at a reduced cost by eliminating the current-sense resistor found in traditional current-mode PWMs. Efficiency is further enhanced by an ability to drive very large synchronousrectifier MOSFETs.
Single-stage buck conversion allows these devices to directly step down high-voltage batteries for the highest possible efficiency. Alternatively, 2-stage conversion(stepping down the +5V system supply instead of the battery) at a higher switching frequency allows the minimum possible physical size.
The MAX1710/MAX1711 are identical except that the MAX1711 have 5-bit DACs and the MAX1710 has a 4-bit DAC. Also, the MAX1711 has a fixed overvoltage protection threshold at VOUT = 2.25V and undervoltage protection at VOUT = 0.8V whereas the MAX1710 has variable thresholds that track VOUT. The MAX1711 is intended for applications where the DAC code may change dynamically.
V+ to GND ............................................................-0.3V to +30V
VCC, VDD to GND ...................................................-0.3V to +6V
PGND to GND.....................................................................±0.3V
SHDN, PGOOD to GND ........................................... -0.3V to +6V
OVP, ILIM, FB, FBS, CC, REF, D0D4,
GNDS, TON to GND....................................-0.3V to (VCC + 0.3V)
SKIP to GND (Note 1)................................-0.3V to (VCC + 0.3V)
DL to PGND...............................................-0.3V to (VDD + 0.3V)
BST to GND...........................................................-0.3V to +36V
DH to LX ....................................................-0.3V to (BST + 0.3V)
LX to BST................................................................-6V to +0.3V
REF Short Circuit to GND .........................................Continuous
Continuous Power Dissipation (TA = +70°C)
24-Pin QSOP (derate 9.5mW/°C above +70°C).............762mW
Operating Temperature Range .........................-40°C to +85°C
Junction Temperature.....................................................+150°C
Storage Temperature Range ...........................-65°C to +165°C
Lead Temperature (soldering, 10s) ...............................+300°C
Note 1: SKIP may be forced below -0.3V, temporarily exceeding the absolute maximum rating, for the purpose of debugging prototype breadboards using the no-fault test mode. Limit the current drawn to -5mA maximum.
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device
Required Field 
